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Tag Archives: articulation agreement

UC and Hong Kong Polytechnic University to sign agreement

sign agreement

University of Cincinnati President Santa J. Ono and Hong Kong Polytechnic University President Timothy W. Tong will initiate a new agreement for a unique dual enrollment program centered on the UC Master of Engineering (MEng) degree and the HKPU Master of Science (MSc) degree. Under this new articulation agreement, students at each university may pursue UC’s MEng and HKPU’s MSc ... Read More »

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